Strategies for Ultra-High Vacuum Encapsulation of Microelectromechanical Components

This project develops strategies for ultra-high vacuum encapsulation of MEMS, including the use of novel getter materials and 3D surface structures to increase the getter volume. In addition, selective getter activation technologies based on inductive heating are investigated to further reduce the internal pressure after bonding. The aim of this research is to achieve stable internal pressures below 1·10-3 mbar, which are essential for high-performance MEMS and future quantum systems.

Duration: 09/2024 – 08/2028

Partner: Fraunhofer Institute for Electronic Nano Systems ENAS