The wedge bonder 4523AD from Kulicke and Soffa is an advanced, programmable wedge bonding system designed specifically for the requirements of the semiconductor and electronics industry. It offers both fully automatic and manual operating modes as well as various semi-automatic modes, allowing flexible customisation for different production requirements.  

The system is designed to process aluminium and gold wire, with wire diameters ranging from 12.7 µm to 76.2 µm for gold and 20.32 µm to 76.2 µm for aluminium. The working area of the bonder covers an area of 135 x 135 cm, which can be moved by a total of 140 mm and finely adjusted by 14 mm. The auto-stepback function for the motorised Y-axis enables precise control of the bonding process with a step width of up to 4 mm. The system's temperature control can be set up to 250° ± 5°C, providing additional flexibility and adaptability for different materials and applications. 

With up to 200 storable programmes, each with up to six independent channels, efficient and reproducible process control can be guaranteed.

If you need to use the wire bonder, please contact the person responsible for the device.