The plasma etching systems from Diener and TePla are used to carry out targeted surface treatment of samples. By using an ionized gas (plasma), they enable the etching and structuring of thin layers without damaging the underlying material. Both chambers can be operated with either argon or oxygen plasma. While the oxygen plasma reacts selectively to organic layers and impurities, the argon plasma removes the top layer homogeneously. The availability of both chambers and gases allows flexible surface treatment of a wide range of samples.

The plasma chamber Zepto from Diener is a compact system with a chamber volume of around 2.6 liters and is ideal for treating small samples. The chamber is closed with a round lid made of borosilicate glass, which allows a good view of the interior. Gas is supplied via two finely adjustable needle valves. The system is controlled semi-automatically, supported by a Pirani vacuum gauge for pressure monitoring. A connected vacuum pump with a suction capacity of at least 3 m³/h ultimately provides the necessary process atmosphere.

The Microwave Plasma System 400 from TePla is a powerful low-pressure plasma system with a chamber volume of 64 liters that has been specially developed for gentle and effective cleaning. Plasma is generated without electrodes using microwaves at 2.45 GHz, which are coupled into the vacuum chamber via a window. This technology enables plasma to be generated over a large area without physical contact with the sample - ideal for processing sensitive components. Plasma cleaning is based on chemical reactions with reactive radicals, which enables fast, gentle treatment. The system has two standard gas channels with mass flow controllers, a capacitive vacuum gauge (range: 10-³ to 10 mbar) and menu-driven software with manual and automatic operating modes, recipe management and comprehensive safety and diagnostic systems.

If you would like to use one of these plasma etcher, please contact the person responsible for the device.