The diamond scriber RV-129 from ATV is specially designed for precise scribe-and-break processes and enables the controlled scribing of materials such as semiconductor wafers, glass or ceramics. The system offers maximum precision and flexibility for different substrate sizes and thicknesses and creates a clean break edge through exact scribe control.  

The rotating vacuum chuck is designed for wafers with a diameter of up to 200 mm and has four locking notches for exact 90-degree positioning. Mounted on an X/Y stage with linear guides, the angle can be fine-adjusted using a micrometer screw with a minimum resolution of 0.006 degrees and an adjustment range of approx. 4°.

The diamond-coated scribing tool has four cutting edges and its angle can be individually adjusted. The scribing pressure can be adjusted in the range from 5 to 581 grams by positioning weights on a scale. The X and Y axes each offer a travel range of 240 mm with a resolution of 10 µm, whereby the device can process substrates with a thickness of up to 10 mm. The touchdown and lift-up positions of the scribing tool are adjustable so that the required scribing length can be precisely determined.  

For optimum visual inspection, the system is equipped with a monocular microscope (approx. 100x magnification), which offers 100 increments. Half a unit corresponds to a resolution of < 8 µm. The integrated lighting ensures a clear view during the entire machining process. A micrometer screw also allows precise height and X-position adjustment to align it exactly with the Y-line in the microscope's crosshairs.

If you need to use the diamond scriber, please contact the person responsible for the device.