The research into new and improved technologies and processes is the basis for the integration of new materials and the further development of smart devices and systems based on them. This includes in particular the establishment of processes with less aggressive process conditions with regard to the use of chemicals and temperature than previous standard processes.

In this context, the Flexible Devices group is working on the further development of assembly and connection technologies, for example in the form of research into a new process for joining wafers and chips based on molecular adhesives at low temperatures. A completely new development in this area, however, is an inverse approach in which various electronic or sensory components up to complete electrical circuits are built on a rigid substrate and then transferred to a flexible substrate.

A hot embossing process for producing functional polymer 3D structures, which our group is developing in close cooperation with the Karlsruhe Nano Micro Facility (KNMFi) within the Karlsruhe Institute of Technology (KIT) and the Fraunhofer Institute for Electronic Nano Systems ENAS, can also be assigned to the research focus "Technologies". The aim is to realize highly miniaturized polymer structures, e.g. for optical components or with adhesive properties.

In addition, other areas of focus of the group's work in the technology area are the development of barrier layers and ultra-barrier layers to protect corrosion-sensitive components and materials against moisture and gases and to stabilize mechanically sensitive structures.