Microtechnological Low-Temperature Joining Using Molecular Adhesion

The aim of this project is to develop novel joining techniques at chip and wafer level using silanes as bonding adhesives. Typical substrates used in the production of MEMS are modified with tailor-made silanes to apply functional groups to the surface and then bond them together. The comparatively low bonding temperatures enable the combination of materials with different thermal expansion coefficients or the integration of temperature-sensitive components such as biomaterials.

Duration: 09/2023 – 08/2027

Partner: Fraunhofer Institute for Electronic Nano Systems ENAS