Physics Colloquium

Dr. G. Reeske and M. Uhlig

Siltronic AG

Reinigung und Epitaxie von Siliziumwafern bei der Siltronic AG

Abstract:

As semiconductor devices continue to scale, the removal of increasingly small particles from silicon wafer surfaces becomes more challenging. This presentation introduces modern wafer cleaning processes, combining chemical methods with ultrasonic cleaning techniques. Special emphasis is placed on particle adhesion, cavitation, and bubble dynamics, which influence both cleaning efficiency and defect formation. Current research on transient cavitation and acoustic hotspots is discussed, highlighting the need for precise control of acoustic fields to enable effective and damage-free cleaning of advanced semiconductor wafers.