Scanning ultrasonic microscopes are used in the semiconductor industry for the non-destructive examination of samples. Reflected ultrasonic waves allow conclusions to be drawn about internal structures and defects. Reliability is increased.

With increasingly complex layer structures and new types of materials, the energy that can be introduced into the depth of the sample and the relative axial resolution of a measurement are decreasing. In order to significantly improve the analysis capability for current and future samples, a new type of analogue high-frequency chain is to be developed. To improve the layer separation and the penetration depth, the transducers are excited with a broadband correlation pattern and the received echo is subjected to pulse compression. Novel transducers and frequency-selective matching networks are being developed for the spectrally broadband emission of the sound waves. The penetration depth into the material is further increased by a novel and compact high-frequency power amplifier cascade. The signal generator to be developed will enable a very high degree of freedom with potential for further applications and research.

• PVA TePla Analytical Systems GmbH & Co.KG
• Industrial Electronic Components GmbH
• Aalen University of Applied Sciences - Engineering and Business - Faculty of Electronics and Computer Science
• TU Bergakademie Freiberg - Junior Professorship for Measurement, Sensor and Embedded Systems (MSE Lab)

The Central Innovation Programme for SMEs (ZIM) supports creative companies in realising good ideas with tailor-made funding opportunities. Funding is provided for R&D cooperation projects between companies or between companies and research institutions for the development of innovative products, processes or technical services without restriction to specific technologies and sectors. They should be carried out in a balanced partnership in which all partners provide innovative services.