SC1.1: Freiberger Siliciumtage 2013 - Freiberger Sawing Symposium

Date: 13th-14th June 2013

Contact: Prof. Dr. Möller / Dr. Würzer

Tel.: 0049 3731 39-2896 / 0049 3731 2033164

Location: Winkler-Bau, Raum WIN-2258

Programm

12. June

  • 18.00 Reception / Get - Together
  • 19.00 Plenary talk

 

13. June

  • 7.30 Registration

New developments in wire sawing of solar silicon

  • 8.30 Diamond wire sawing of monocrystalline silicon
    Bye, J.-I..; (NorSun, Oslo, Norway)
  • 9.00 Model of diamond wire abrasion: prediction of wire bow and wafer TTV
    Sunder, K.; (PV Silicon, Erfurt, Germany)
  • 9.30 Diamond wire sawing
    Jouini, A. (INES, Le-Bourget, France)
  • 10.00 Coffee break
  • 10.30 Industrial sawing of multicrystalline silicon
    Naumann, O. (SolarWorld AG, Freiberg, Germany, asked)
  • 11.00 Fundamentals mechanism of diamond wires sawing
    Buchwald, R. (THM Freiberg, Germany)
  • 11.30 Requirements for diamond wire saws
    Dechant-Wagner, R. (Odevis Automation, Villingen-Schwenningen, Germany)
  • 12.00 Lunch break
  • 14.00 Slurry based sawing
    Dalaker H. (Sintef, Trondheim, Norway)
  • 14.30 Extending the slurry based process window for PV wafer slicing
    Jodlowski, T. (Applied Materials HCT, Cheseaux, Switzerland)

 

Wire sawing of compound materials

  • 15.00 Sawing of 300 mm silicon wafers
    Pietsch, R. (Siltronic AG, Burghausen, asked)
  • 15.30 Coffee break
  • 16.00 Sawing of GaAs and hard compound semiconductors
    Eichler, K. (FCM, Freiberg, Germany, asked)
  • 16.30 Sawing of sapphire crystals
    Assi, F. (Meyer Burger, Thun, Switzerland)
  • 17.00 End of afternoon session

 

Friday, June 14

Supply materials

  • 8.30 Development of tailor made wafering fluids
    Seelmann-Eggebert, H.-P., Reis-Walther, E.-M. (BASF, Ludwigshafen, Germany)
  • 9.00 Recycling of SiC - Slurries
    Mayer-Uhma, T. (SiC Processing, Bautzen, Germany)
  • 9.30 Development of diamond wires
    Wei Che (Saint Gobain, Northboro, USA)
  • 10.00 Coffee break

 

Wafer characterization, fundamentals

  • 10.30 On the origin of saw marks in slurry based sawing
    Möller, H. J. (FhG THM, Freiberg, Germany)
  • 11.00 Investigation of wafer saw damage
    Wasmer, K. (EMPA, Bern, Switzerland)
  • 11.30 Methods for investigating the subsurface damage at bevel polished wafer samples
    Grün, A. (CIS, Erfurt, Germany)
  • 12.00 Subsurface damage in as-sawn silicon wafers
    Würzner, S. et al. (FhG - THM, TUBAF, Freiberg, Germany)
  • 12.30 Mechanical properties of solar silicon wafers
    Schönfelder, S. (FhG CSP, Halle, Germany)
  • 13.00 Final remarks, end of Symposium
  • 13.15 Lunch break
  • 14.00 Visit of the Fraunhofer THM - sawing and crystal growth facilities